产品
Guangdong Shuocheng Technology Co., LTD
Focusing on PCB/IC substrate hole metal electronic chemicals, PCB/IC substrate dry film type photoresist, and functional film materials in the fields of semiconductor wafer cutting, wafer thinning, and advanced packaging
Marketing Center (South China)
Guangdong Lier Chemical Co., LTD
Marketing Center (East China)
Suzhou Shuoan Electronic Technology Co., LTD
Business contact information
防焊干膜
防焊干膜产品简介
产品特性
圆形解析能力50μm，隔焊条能力50μm(基于25μm厚度)
耐热性(浸锡，漂锡 288°C，10S，3次)
耐化性(电镀银，镍银金，镍钯金，镍金，电镀金，OSP等)
耐溶剂(酒精，丁酮，PMA等常规溶剂)
无卤素，满足ROHS、REACH，UL认证
电子迁移(SIR):>10^122(IPC-TM-650)
绝缘电阳:>10^13 Q
产品应用
适用于PCB:载板，服务器，高频传输及常规类产品
产品规格
