产品
Guangdong Shuocheng Technology Co., LTD
Focusing on PCB/IC substrate hole metal electronic chemicals, PCB/IC substrate dry film type photoresist, and functional film materials in the fields of semiconductor wafer cutting, wafer thinning, and advanced packaging
Marketing Center (South China)
Guangdong Lier Chemical Co., LTD
Marketing Center (East China)
Suzhou Shuoan Electronic Technology Co., LTD
Business contact information
MSAP制程图形填孔SCC-EXF300
MSAP制程图形填孔SCC-EXF300产品简介
产品特性
可适用于高厚径比微小盲孔的填充
可抑制通孔拐角铜厚偏薄现象
镀液表现稳定,镀层光亮,结晶细密,延展性好,电镀铜厚分布均匀
工作槽液可用HULL槽和CVS分析监控，易于维护
圆弧率可低于20%
工艺参数
