产品
Guangdong Shuocheng Technology Co., LTD
Focusing on PCB/IC substrate hole metal electronic chemicals, PCB/IC substrate dry film type photoresist, and functional film materials in the fields of semiconductor wafer cutting, wafer thinning, and advanced packaging
Marketing Center (South China)
Guangdong Lier Chemical Co., LTD
Marketing Center (East China)
Suzhou Shuoan Electronic Technology Co., LTD
Business contact information
SAP制程蚀刻SCC-SET
SAP制程蚀刻SCC-SET产品简介
产品特性
蚀刻速度慢(0.5-1.5μm/min)且稳定,易于管理
抑制线路底部侧蚀,蚀刻均匀,图形与设计值尺寸变化小
蚀刻后铜面粗糙度增加
图形间绝缘阻抗小,表现良好
圆弧率小于25%
工艺参数
蚀刻速率:0.5-1.5μm/min
无侧蚀
圆弧率<25%
粗糙度<200nm
