产品
Guangdong Shuocheng Technology Co., LTD
Focusing on PCB/IC substrate hole metal electronic chemicals, PCB/IC substrate dry film type photoresist, and functional film materials in the fields of semiconductor wafer cutting, wafer thinning, and advanced packaging
Marketing Center (South China)
Guangdong Lier Chemical Co., LTD
Marketing Center (East China)
Suzhou Shuoan Electronic Technology Co., LTD
Business contact information
MSAP制程蚀刻SCC-MET
MSAP制程蚀刻SCC-MET产品简介
产品特性
适合电路形成蚀刻、干膜压膜前处理、阻焊剂涂布前处理、电镀前处理
可解决电镀后针孔、侧蚀的情况
蚀刻速度快(4-5μm/min),线路蚀刻干净,无残铜
蚀刻前后图形与设计值尺寸变化小,且蚀刻后图形顶部平坦,底部无细缝
可抑制VIA、PTH的拐角部的过蚀刻,保证其内部蚀刻均匀
圆弧率小于25%
工艺参数
蚀刻速率<0.5μm
蚀刻针孔<100
