product

产品

semiconductor industry

Wafer cutting film series

Introduction to Wafer cutting film series products

Product Features

Polyvinyl chloride film is used as the base material to coat special adhesives that are synthesized independently

Moderate viscosity, uniform thickness, no flying material, no glue residue

Product Application

Suitable for semiconductor wafer fabs or packaging factories to do wafer back grinding, cutting, and thinning processes

Product Specification

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