High-temperature resistant composite series
Introduction to High-temperature resistant composite series products
Product Features
It is made by compounding polyimide or polyester film with ultra-heat-resistant paper, and coated with a silicone-based adhesive. It features no adhesive residue, no tin penetration, moderate viscosity, and easy peeling.
Product Application
Mainly used in PCB circuit board manufacturing process applications: protection of gold fingers in lead-free/lead-containing hot air solder leveling (HASL) processes, and protection of gold fingers in immersion silver and immersion tin processes.
Product Specification
