product
产品
Guangdong Shuocheng Technology Co., LTD
Focusing on PCB/IC substrate hole metal electronic chemicals, PCB/IC substrate dry film type photoresist, and functional film materials in the fields of semiconductor wafer cutting, wafer thinning, and advanced packaging
Marketing Center (South China)
Guangdong Lier Chemical Co., LTD
Marketing Center (East China)
Suzhou Shuoan Electronic Technology Co., LTD
Business contact information
Anti-welding dry film
Introduction to anti-welding dry film products
Product Features
Circular resolution: 50μm, Solder strip capability: 50μm (based on 25μm thickness)
Heat resistance (tin dipping, tin floating 288°C, 10S, 3 times)
Chemical resistance (electroplated silver, nickel silver gold, nickel palladium gold, nickel gold, electroplating, OSP, etc.)
Solvent resistance (alcohol, butanone, PMA and other conventional solvents)
Halogen-free, meet ROHS, REACH, UL certifications
Electron Migration (SIR): >10^122 (IPC-TM-650)
Insulation resistance: >10^13 Q
Product Application
Suitable for PCB: carrier boards, servers, high-frequency transmission and conventional products
Product Specification
