Colloidal palladium has good stability and can be applied to horizontal electroless copper plating lines.

High activity and low dosage，which can reduce production costs

No acid mist is generated during use, ensuring environmental friendliness and safety.

The plate is widely compatible and can cover various types of plates such as ordinary blind orifice plates, POFV, halogen-free material plates, etc

Copper is finely crystallined, has good toughness, and has good bonding