product
产品
Guangdong Shuocheng Technology Co., LTD
Focusing on PCB/IC substrate hole metal electronic chemicals, PCB/IC substrate dry film type photoresist, and functional film materials in the fields of semiconductor wafer cutting, wafer thinning, and advanced packaging
Marketing Center (South China)
Guangdong Lier Chemical Co., LTD
Marketing Center (East China)
Suzhou Shuoan Electronic Technology Co., LTD
Business contact information
有镍化学沉铜
有镍化学沉铜产品简介
产品特性
活化槽液无沉淀淤泥,槽液寿命长达100平米/升
沉铜后在板面没有钯残留
孔内树脂及玻纤吸钯薄而均匀,降低了沉镍金表面处理工艺NPTH孔上金的几率
单槽反应时间短，一次性设备投资成本低
化铜沉积层应力小,做板镀铜耐288°C*10S*8/10次条件下热冲击,降低了盲孔底部拉裂及通孔内联ICD的风险
制程能力优势
A.通孔AR Max:20:1
B.盲孔AR Max:1.5:1
c.板厚:0.05~6.0mm
产品应用
产品规格
