product
产品
Guangdong Shuocheng Technology Co., LTD
Focusing on PCB/IC substrate hole metal electronic chemicals, PCB/IC substrate dry film type photoresist, and functional film materials in the fields of semiconductor wafer cutting, wafer thinning, and advanced packaging
Marketing Center (South China)
Guangdong Lier Chemical Co., LTD
Marketing Center (East China)
Suzhou Shuoan Electronic Technology Co., LTD
Business contact information
Low-stress copper sinking in the MSAP process
Introduction to Low-stress copper sinking in the MSAP process products
Product Features
Solve the technical requirements of low stress and corrosion resistance for the MSAP process
On current mass-produced and advanced dielectric materials, they have an outstanding and uniform surface morphology after glue removal
Stable and good performance, the prepondered copper crystalline is dense, and has a good backlight effect
Copper immersion copper coating has excellent adhesion and high ductility
On advanced dielectric materials, it has high deep plating capabilities
In advanced dielectric materials, high tensile strength is required
Process Parameters
