product

产品

Through hole/fill hole/pattern

Copper plated SCC-EC-11

Introduction to Copper plated SCC-EC-11 products

Product Features

The maintenance cycle is long, and the anode does not need to be cleaned for a year

Excellent ductility, with ductility > 20%

The aspect ratio is 8:1.20ASF current density, and the TP value is tested at more than 85% by the six-point method

Thermal shock test: 288°C tin bleaching 5 times, 10S each time, slicing analysis ACC after tin bleaching

Reduces the difficulty of etching lines while cutting consumption by at least 12% or more

The unique leveling technology is less likely to produce clamping and can increase the current by at least 10%

Process Parameters

镀铜SCC-EC-11系列_22.jpg