product

产品

Through hole/fill hole/pattern

Copper plated SCC-EC-200U

Introduction to Copper plated SCC-EC-200U products

Product Features

Excellent board coverage ability, bright and flat board surface

Wide operating current density range: Current density: 15-40 ASF

Use soluble anode, there is minimal anode slime, and the anode maintenance cycle is more than 9-12 months

The deep plating capacity is good, the deep plating capacity of the 6:1 aspect ratio plate is measured by more than 80%, the deep plating capacity of the 8:1 aspect ratio plate is measured by more than 70%, and the deep plating capacity of the 10:1 aspect ratio plate is measured by more than 60% at two points

Process Parameters

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