product

产品

Through hole/fill hole/pattern

High-speed blind hole filling photonic agent SCC-VH500

Introduction to High-speed blind hole filling photonic agent SCC-VH500 products

Product Features

Suitable for insoluble anodes

Can be used for blind hole filling (hole diameter 2-8mil)

It exhibits excellent hole-filling capability and outstanding surface copper control performance within a current density range of 2 ASD - 5 ASD

The plating solution performance is stable, the plating layer is bright, the crystallization is fine, the ductility is good, and the copper thickness of the electroplating is evenly distributed

The working tank fluid can be monitored with HULL tank and CVS analysis, and is easy to maintain

The temperature of the working bath should be controlled within the range of 28 - 35℃

Process Parameters

SUB制程填孔产品(高速盲孔填平光剂SCC-VH500系列)_26.jpg