High-speed blind hole filling photonic agent SCC-VH500
Introduction to High-speed blind hole filling photonic agent SCC-VH500 products
Product Features
Suitable for insoluble anodes
Can be used for blind hole filling (hole diameter 2-8mil)
It exhibits excellent hole-filling capability and outstanding surface copper control performance within a current density range of 2 ASD - 5 ASD
The plating solution performance is stable, the plating layer is bright, the crystallization is fine, the ductility is good, and the copper thickness of the electroplating is evenly distributed
The working tank fluid can be monitored with HULL tank and CVS analysis, and is easy to maintain
The temperature of the working bath should be controlled within the range of 28 - 35℃
Process Parameters
