Suitable for both soluble and insoluble anodes

The ultra-thin film thickness of the hole can be realized at 155um, and it has good hole filling performance

It can inhibit the thin copper thickness at the corners of the through-holes

Achieve ultra-thin face copper, reduce copper sulfate usage and production costs

The plating solution performance is stable, the plating layer is bright, the crystallization is fine, the ductility is good, and the copper thickness of the electroplating is evenly distributed

The working tank fluid can be monitored with HULL tank and CVS analysis, and is easy to maintain