product
产品
Guangdong Shuocheng Technology Co., LTD
Focusing on PCB/IC substrate hole metal electronic chemicals, PCB/IC substrate dry film type photoresist, and functional film materials in the fields of semiconductor wafer cutting, wafer thinning, and advanced packaging
Marketing Center (South China)
Guangdong Lier Chemical Co., LTD
Marketing Center (East China)
Suzhou Shuoan Electronic Technology Co., LTD
Business contact information
高纵横比X型孔填孔SCC-VL300
高纵横比X型孔填孔SCC-VL300产品简介
产品特性
可薄膜填充高长宽的X型通孔
可实现通言共镀,也适用于MSAP图形填孔
面铜厚度低，可降低电镀成本
镀液表现稳定,镀层光亮,结晶细密,延展性好,电镀钢厚分布均匀
工作槽液可用HULL槽和CVS分析监控，易于维护
圆弧率可低于20%
产品应用
产品规格
