product
产品
Guangdong Shuocheng Technology Co., LTD
Focusing on PCB/IC substrate hole metal electronic chemicals, PCB/IC substrate dry film type photoresist, and functional film materials in the fields of semiconductor wafer cutting, wafer thinning, and advanced packaging
Marketing Center (South China)
Guangdong Lier Chemical Co., LTD
Marketing Center (East China)
Suzhou Shuoan Electronic Technology Co., LTD
Business contact information
High aspect ratio X-shaped hole filling SCC-VL300
Introduction to High aspect ratio X-shaped hole filling SCC-VL300 products
Product Features
Suitable for film-filled X-shaped through-holes with high length- width ratios
It can realize common co-plating, and is also suitable for MSAP graphic hole filling
The low thickness of the copper can reduce the cost of electroplating
The plating solution performance is stable, the plating layer is bright, the crystallization is fine, the ductility is good, and the copper thickness of the electroplating is evenly distributed
The working tank fluid can be monitored with HULL tank and CVS analysis, and is easy to maintain
Arc rate can be less than 20%
Process Parameters
