Suitable for filling small blind holes with high thickness-to-diameter ratio

It can inhibit the phenomenon of thin copper thickness at the corners of the through-hole

The plating solution performance is stable, the plating layer is bright, the crystallization is fine, the ductility is good, and the copper thickness of the electroplating is evenly distributed

The working tank fluid can be monitored with HULL tank and CVS analysis, and is easy to maintain

Arc rate can be less than 20%