product

产品

Soft board electroplating

Copper plated FH100

Introduction to Copper plated FH100 products

Product Features

Excellent ductility with a ductility ≥ 24%

The aspect ratio is 8:1, the current density of 20ASF, and the TP value is above 85% in the six-point method test

Thermal shock test: 288C tin bleaching 5 times, 10S each time, slice analysis ACC after tin bleaching

Reduce the difficulty of etching lines while cutting consumption by at least 10% or more

The unique leveling technology is less likely to produce clamping and can increase the current by at least 10%

Process Parameters

软板电镀 镀铜FH100_35.jpg