product
产品
Guangdong Shuocheng Technology Co., LTD
Focusing on PCB/IC substrate hole metal electronic chemicals, PCB/IC substrate dry film type photoresist, and functional film materials in the fields of semiconductor wafer cutting, wafer thinning, and advanced packaging
Marketing Center (South China)
Guangdong Lier Chemical Co., LTD
Marketing Center (East China)
Suzhou Shuoan Electronic Technology Co., LTD
Business contact information
SAP process etching SCC-SET
Introduction to SAP process etching SCC-SET products
Product Features
The etching rate is slow (0.5-1.5μm/min) and stable for easy management
It inhibits the side erosion of the bottom of the line, the etching is uniform, and the size of the graphic and design value changes is small
The roughness of the copper surface increases after etching
The insulation impedance between the graphics is small and the performance is good
Arc rate less than 25%
Process Parameters
Etch rate: 0.5-1.5μm/min
No lateral erosion
Arc rate< 25%
Roughness < 200nm
