product
产品
Guangdong Shuocheng Technology Co., LTD
Focusing on PCB/IC substrate hole metal electronic chemicals, PCB/IC substrate dry film type photoresist, and functional film materials in the fields of semiconductor wafer cutting, wafer thinning, and advanced packaging
Marketing Center (South China)
Guangdong Lier Chemical Co., LTD
Marketing Center (East China)
Suzhou Shuoan Electronic Technology Co., LTD
Business contact information
Etching SCC-MET by MASP process
Introduction to Etching SCC-MET by MASP process products
Product Features
Suitable for circuit formation etching, pre-treatment for dry film lamination, pre-treatment for solder mask coating, and pre-treatment for electroplating
Can solve the situation of pinhole and side erosion after electroplating
The etching speed is fast (4-5μm/min), and the line is etched cleanly without residual copper
The size of the graphic and design value before and after etching changes little, and the top of the graphic after etching is flat, and there is no fine seam at the bottom
Can inhibit over-etching at the corners of VIA and PTH to ensure uniform internal etching
Arc rate less than 25%
Process Parameters
The etch rate < 0.5μm
Etch pinhole < 100
