product
产品
Guangdong Shuocheng Technology Co., LTD
Focusing on PCB/IC substrate hole metal electronic chemicals, PCB/IC substrate dry film type photoresist, and functional film materials in the fields of semiconductor wafer cutting, wafer thinning, and advanced packaging
Marketing Center (South China)
Guangdong Lier Chemical Co., LTD
Marketing Center (East China)
Suzhou Shuoan Electronic Technology Co., LTD
Business contact information
HDI dry film preparation SCC-NET01
Introduction to HDI dry film preparation SCC-NET01 products
Product Features
Enhances the adhesion between copper and etch resist
Enables the formation of fine uneven (or textured) patterns on the copper surface
Free of phosphoric acid, which helps reduce waste liquid treatment costs
Suitable for both dipping and spraying treatment
Product Capability
Etch volume: 0.2-0.3μm
The copper surface can form a concave and convex shape
Bond strength: 0.50-1.5 N/CM
