Inorganic film removal liquid SCC-PET01
Introduction to Inorganic film removal liquid SCC-PET01 products
Product Features
Free of nitrogen and phosphorus components, which can reduce the treatment cost of waste liquid
Can inhibit sodium hydroxide from attacking the substrate
Suitable for dipping and spraying treatment
Product Capability
Etch volume: 0.2-0.3μm
The copper surface can form a concave and convex shape
Bond strength: 0.50-1.5 N/CM