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Surface treatment of copper surface

Inorganic film removal liquid SCC-PET01

Introduction to Inorganic film removal liquid SCC-PET01 products

Product Features

Free of nitrogen and phosphorus components, which can reduce the treatment cost of waste liquid

Can inhibit sodium hydroxide from attacking the substrate

Suitable for dipping and spraying treatment

Product Capability

Etch volume: 0.2-0.3μm

The copper surface can form a concave and convex shape

Bond strength: 0.50-1.5 N/CM