Suitable for PCB: carrier boards, servers, high-frequency transmission and conventional products

Reduce costs and improve space management

Can solve the problem of large open areas, copper thickness of over 20Z, and the lack of rubber in the plate

Replace 3-8 sheets of kraft paper, reducing costs by 20-40%

Improve cleanroom cleanliness

Can be used as dummy board to reduce the use of kraft paper or sheet materials

Automatic counting accurately monitors service life

Adapt to the requirements of automated operations, reduce labor costs, and improve work efficiency

Reuse 300-500 times (define the number of times the buffer can be used according to the customer's production conditions and product form) to reduce customer costs

Improving the uniform temperature and pressure is solved, and the problem of layer bias in the pressing process of high-level plates is solved

Suitable for electronic and electrical, medium-to-high-end adhesive tapes, labels, die-cutting processing, CCL pressing and other industries

Mainly used in PCB circuit board manufacturing process applications: protection of gold fingers in lead-free/lead-containing hot air solder leveling (HASL) processes, and protection of gold fingers in immersion silver and immersion tin processes.